- Streamer, Headphone Amp, Preamp & More
- Play Music via NAS, LAN, or USB
- Improve TV Audio via HDMI ARC
- Dual-Band Wi-Fi & Ethernet
- 6″ 2160 x 1080 Portrait Display
- Add Apps with Open Android OS
- Pair of 8-Channel ES9038PRO DACs
- 8-Channel THX AAA 788+ Amp
- 4th Gen FPGA & Qualcomm Snapdragon 660
- 5-Stage Hi-Fi Audio Architecture
8 Channel ES9038PRO DAC x 2
With the ES9038PRO having been featured in the M17, Q7, K9 Pro SS and MS15S, we no w have much experience with the chip to enable it to push audio quality to new heights. The R9 employs two ES9038PRO DACs, one each for the left and right channels. Each DAC chip contains 8 independent D/A converters, and these 8 channels are connected in parallel for a fully differential output. The result is precise, clear yet full sound.
Next-gen THX AAA 788+
Inside the R9 is an 8-channel THX AAA 788+ headphone amplifier design. These headphone amps, fed by a high-voltage power supply, are connected in parallel via 2×2 groups for a four-way fully balanced design, greatly enhancing transient performance. The comb-shaped heat sinks and optimised circuit layout dissipate heat efficiently, ensuring the R9 is capable of continuous and stable high-power output. The result is that the R9 is capable of outputting 7300mW per channel at 32Ω, 102% higher than that of R7
Fully-connected HiFi Audio Architecture Five Gain Levels
The R9 boasts impressive audio performance thanks to its five-stage audio architecture with carefully-crafted IV, LPF, gain, pre-amplification, and current expansion stages. An important part of the audio circuit is the OPA2211 op-amps, which are made through the silicon-germanium (SiGe) CMOS manufacturing process that ensures the chip’s excellent performance. The variable gain and variable power supply voltage design result in 5 levels of gain, allowing you to exactly dial in your desired listening volume. No matter if you are using IEMs or hard-to-drive headphones, you will get a great listening experience.
Carefully-designed PCB Every Inch Considered
The R9’s internal power supply, digital portions, DAC, and headphone amplifier all reside on separate boards. Additionally, there are metal shields to fully isolate the DAC and THX headphone amp sections. These four major parts of the audio circuit are separated into independent boards to avoid crosstalk, which further ensures that the audio signals being processed and their output are accurate, clean, and retain their dynamics.
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